A conversation with Teradyne manager of reliability Mark Levin and senior software engineering manager Jon Bodin about reliability, DfM, and their new book Improving Product Reliability and Software Quality: Strategies, Tools, Process and Implementation, 2nd Edition.
RM 116: Supply Chain Musings with Mark Godwin of Ventec
PCB Chat 113: David Schild of the Printed Circuit Board Association of America
PCB Chat 112: Vivek Bansal on VVDN’s Vertical Integration Model
PCB Chat 111: Metallic Resources on Reclaiming Electronics Solder
RM 115: Making Sense of ’Big Data’
PCB Chat 110: Steve Robinson of APCT
RM 114: The Remarkable Return of the Post-Reflow Cleaning Process
RM 113: Counterfeit Component Detection with Dr. Eyal Weiss
Business Challenges with STI Electronics’ President David Raby
PCB Chat 109: Wally Rhines on the PCB Design Software Market
PCB Chat 108: Travis Kelly on Government Support of the US PCB Industry
RM 112: ESD Mitigation with ESD Expert Christopher Almeras
RM 111: Liquid Metal’s Potential Future in Electronics
RM 109: A Decade of Industry 4.0 - What it Was - What it Wasn’t
PCB Chat 107: Valentina Ratner and Kyle Dumont of AllSpice
PCB Chat 106: Madan Jagernauth on the Latest HDP Projects
RM 108: SMTA Pan Pacific Microelectronics Symposium Preview
RM 107: IPC Validation Services & the Trusted Supplier Program
RM 106: A Conversation about Production Automation
PCB Chat 105: Low-Heat Solders with Ian Tevis of SAFI-Tech and Andy Mackie of Indium
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