Dr. Jennie Hwang's wide-ranging career encompasses international business operations, sustained leadership in worldwide manufacturing and technology services, innovative research, intellectual property management, global leadership positions, as well as corporate and university governance.
Dr. Hwang has held senior executive positions with Lockheed Martin. SCM Corp., Sherwin Williams., and was the CEO of International Electronic Materials Corp. as well as co-founded entrepreneurial companies. Currently, her company provides business, technology and manufacturing solutions to the global industry. She has served as an advisor to many Fortune 500 multinational companies, as well as the US government programs.
Her formal education includes Harvard Business School’s Executive Program, Columbia University Business School Corporate Governance program, and four academic degrees (Ph.D., MS, MA, BS) in engineering & sciences from Case Western Reserve University, Columbia, Kent State-Liquid Crystal Institute and Cheng-Kung University, respectively. She was the first female to earn a doctorate from Case Western Reserve University's Engineering School - Materials Science & Engineering and has served on the university's board of trustees since 1996.
RM 142: Live from SMTA's Pan Pacific Strategic Electronics Symposium (PanPac)
RM 141: Component Tape Splicing Best Practices
PCB Chat 129: Electronics Design Market Update with Wally Rhines
PCB Chat 128: The Latest HDP Consortium Projects
RM 139: Environmentally Responsible Alternatives to Traditional PCB Fabrication
PCB Chat 127: Matthias Wagner on AI-Based PCB Design Tools
RM 138: Hand Soldering and Rework Best Practices
RM 137: Building a Sustainable Career with a Sustainable Impact
PCB Chat 127: David Schild on US Strategy for Supply Chain Readiness
PCB Chat 126: Andrew Scheuermann on AI in Electronics
RM 136: Environmentally Responsible/Sustainable Conformal Coating
PCB Chat 125: Manny Marcano on Spinoff of Accelerated Designs
PCB Chat 124: Wally Rhines on the Latest PCB Design Software Market Data
RM 135: Zach Peterson about Board Design Best Practices
RM 134 -- 2023 Podcast Season Wrap-Up
RM 133: Novel Wireless / Wearable ESD Monitoring
PCB Chat 123: US PCB Legislation Update with David Schild of PCBAA
PCB Chat 122: Robert Feranec on PCB Design
RM 132: HZO’s Lisa Rizzo on Ultra-Thin Conformal Coating
RM 131: Industry Icon Bob Willis
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