In this week’s Fish Fry, we’re following a microcontroller yellow brick road to a land where analog reigns supreme. Dave Smith (Texas Instruments) joins us to discuss the details of the "Smart Analog Combo" included in in the MSP430 family, the benefits of the configurable signal-chain elements inherent in this solution, and why the FRAM memory found in this new family sets it apart from other solutions on the market. Also this week, we investigate how “nano-bubbles” are being used in cancer treatment therapy. To finish things up, we look at how the KSIM tool can help you choose the right capacitor for your design.
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Links for July 20, 2018
Integration at its core: New MSP430™ MCUs offer configurable signal-chain elements for sensing applications
Feature Article by Jim Turley: MCUs For the Indecisive - TI’s Microcontroller Family Has a Bit of Everything
Controlled gene and drug release from a liposomal delivery platform triggered by X-ray radiation (whitepaper)
New Episode of Chalk Talk: KSIM: Capacitors
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Fish Fry Executive Interviews
Darrin Billerbeck, CEO – Lattice Semiconductor
Anupam Bakshi, CEO – Agnisys
Dave Kleidermacher, CTO – Green Hills Software
Robert Blake, CEO – Achronix
Jack Harding, CEO – eSilicon
Michiel Ligthart, COO – Verific
Adnan Hamid, CEO – Breker Technologies
Jeff Waters, VP and General Manager – Altera
Simon Davidmann, CEO – Imperas
Ted Miracco, CEO – SmartFlow Compliance Solutions
Jessica Gomez – Rogue Valley Microdevices
Shishpal Rawat, Chairman – Accellera Systems Initiative
Kevin Bromber, CEO – myDevices
Daniel Hansson, CEO – Verifyter
Mark Papermaster, CTO – AMD
David Fried, CTO – Coventor
Dr. Steven LeBoeuf, President – Valencell
David Dutton, CEO – Silvaco
Bob Niemiec, CEO – TwistThink
Allan Martinson, COO – Starship Technologies
Zhihong Liu, Chairman and CEO – ProPlus Solutions
Taher Madraswala, CEO and President – Open-Silicon>
Kapil Shankar, CEO and Director – AnDAPT
Dan Fox, CTO – Local Motors
Kim Rowe, Founder and CEO — RoweBots
Lawrence Cooke, Founder and CEO — NovaSolix
Gregg Recupero, CTO — Performance-IP
Alan Grau, CEO — Icon Labs
Carl Alberty, Vice President – Cirrus Logic
Maximilian Odendahl, CEO — Silexica
Finbarr Moynihan, General Manager — MediaTek
Sanjay Pillay, CEO — Austemper
Louis Parks, CEO – SecureRF
Harold Blomquist, CEO – Helix Semiconductor
Dale Dougherty and Sherry Huss, Co-Founders – Maker Faire
Mike Wisart, CEO – efabless
Chris Giovanniello, SVP and Co-Founder – Menlo Micro
Jake Janovetz, President – Opal Kelly
Jerry Gipper, Executive Director – VITA
Ethan Plotkin, CEO – GDCA
Xin Song, CEO - Bottos
Chris Dries, CEO – UnitedSiC
Bob Smith, Executive Director - ESD Alliance
Rick O'Connor, Executive Director - RISC V Foundation
Adventures in Hybrid Processing: A New Approach for Today’s Multitasking World
Deep-Tech Disruption: How imec is Advancing Startup Innovation with Imec.DeepTechVentures
Seeing with Phlux: A New Era for Infrared Photodiode Sensor Technology
Digital Signal Processing and the AI Architecture Evolution
Space According to LEO: How Low Earth Orbit Satellite Technology Is Opening Up New Space Applications
Decision Superiority, Shared Intelligence and The Future of Battlefield AI
The Future of AI will be Sparse
Thin-Film Piezoelectric MEMS: A New Day for Exciting MEMS Applications
AI, Simulation and A New Frontier of Space Applications
High Flying Digital Signal Processing! New Design Possibilities with HiFi DSPs
The Future Will Be Spicy! Building Better Hardware More Efficiently with Allspice
New Avenues for Open Standards: Expanding VITA into Broader Markets
Lions, Tigers, and Jellyfish! Cutting-Edge Technologies for Wildlife Tracking
Solving the Unsolvable: How Technology Acceleration is Transforming Information Delivery
DVCon 2024: Seeing Beyond The Next Big Thing in EDA
The Importance of Supply Chain Resilience - Common Points of Failure, Obsolescence, and The Path Forward
The World Needs Analog: How Celera is Changing the Future of Analog Design
Better AI Needs Better Data: How FeatureByte is Radically Simplifying the AI Data Lifecycle
SoMs, CoMs, and Cutting Edge Capabilities in Open Architecture Systems
Happy Together: Rapid Innovation with Chiplets and FPGAs
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