According to Puneet Gupta, Ph.D. and his colleagues at UCLA including Subramanian Iyer, Ph.D., the printed circuit board is a constraint on electronics size and speed. And the solution is to get rid of it. The professors have developed a method to replace PCBs with an all-silicon technology, called silicon-interconnect fabric, which allows bare chips to be connected directly to wiring on a separate piece of silicon. The wiring between chips on fabric is at the nanometer scale, much like the wiring within a chip. Dr. Gupta asserts many more chip-to-chip connections are thus possible, and those connections are able to transmit data faster while using less energy. He discusses the technology and its implications with PCB Chat host Mike Buetow.
RM 142: Live from SMTA's Pan Pacific Strategic Electronics Symposium (PanPac)
RM 141: Component Tape Splicing Best Practices
PCB Chat 129: Electronics Design Market Update with Wally Rhines
PCB Chat 128: The Latest HDP Consortium Projects
RM 139: Environmentally Responsible Alternatives to Traditional PCB Fabrication
PCB Chat 127: Matthias Wagner on AI-Based PCB Design Tools
RM 138: Hand Soldering and Rework Best Practices
RM 137: Building a Sustainable Career with a Sustainable Impact
PCB Chat 127: David Schild on US Strategy for Supply Chain Readiness
PCB Chat 126: Andrew Scheuermann on AI in Electronics
RM 136: Environmentally Responsible/Sustainable Conformal Coating
PCB Chat 125: Manny Marcano on Spinoff of Accelerated Designs
PCB Chat 124: Wally Rhines on the Latest PCB Design Software Market Data
RM 135: Zach Peterson about Board Design Best Practices
RM 134 -- 2023 Podcast Season Wrap-Up
RM 133: Novel Wireless / Wearable ESD Monitoring
PCB Chat 123: US PCB Legislation Update with David Schild of PCBAA
PCB Chat 122: Robert Feranec on PCB Design
RM 132: HZO’s Lisa Rizzo on Ultra-Thin Conformal Coating
RM 131: Industry Icon Bob Willis
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