SMTA is well known for producing high-quality relevant technical conferences and symposiums. This includes, among others, the technical conference held at SMTAI, the High Reliability Cleaning and Coating Conference, the Symposium on Counterfeit Parts and Materials, the Advanced Electronics Assembly Conference, the Wafer-Level Packaging Symposium, the Electronics in Harsh Environments conference, and the Pan Pacific Microelectronics Symposium, often referred to as Pan Pac.
Pan Pac is unique in many ways, beginning with its venue. Pan Pac is held annually at one of the Hawaian islands. This fact alone makes this symposium stand out. But there are many other factors that make this symposium unique. As Pan Pac’s steering committee says:
"The Pan Pacific Microelectronics Symposium strives to build bridges and nurture relationships across all boundaries, oceans and cultures, industries and technologies, companies and individuals. Its location in Hawaii always provides the requisite isolation from day-to-day distractions necessary to support these goals and enhance personal face to face interactions. The Pan Pacific continues its mission of building the vision and future directions for the electronics industry!"
Pan Pac 2023 is scheduled for January 30 - February 2, 2023, at the Sheraton Kauai Resort on the island of Kauai.
To talk more about the upcoming Pan Pacific Symposium, Mike Konrad invited two colleagues who are instrumental in curating the technical contact for this symposium. Dr. Chuck Bauer, one of the creators of this symposium, and Keith Bryant join him to discuss the conferences technical tracks and presentations as well as their view on what makes this conference unique.
RM 142: Live from SMTA's Pan Pacific Strategic Electronics Symposium (PanPac)
RM 141: Component Tape Splicing Best Practices
PCB Chat 129: Electronics Design Market Update with Wally Rhines
PCB Chat 128: The Latest HDP Consortium Projects
RM 139: Environmentally Responsible Alternatives to Traditional PCB Fabrication
PCB Chat 127: Matthias Wagner on AI-Based PCB Design Tools
RM 138: Hand Soldering and Rework Best Practices
RM 137: Building a Sustainable Career with a Sustainable Impact
PCB Chat 127: David Schild on US Strategy for Supply Chain Readiness
PCB Chat 126: Andrew Scheuermann on AI in Electronics
RM 136: Environmentally Responsible/Sustainable Conformal Coating
PCB Chat 125: Manny Marcano on Spinoff of Accelerated Designs
PCB Chat 124: Wally Rhines on the Latest PCB Design Software Market Data
RM 135: Zach Peterson about Board Design Best Practices
RM 134 -- 2023 Podcast Season Wrap-Up
RM 133: Novel Wireless / Wearable ESD Monitoring
PCB Chat 123: US PCB Legislation Update with David Schild of PCBAA
PCB Chat 122: Robert Feranec on PCB Design
RM 132: HZO’s Lisa Rizzo on Ultra-Thin Conformal Coating
RM 131: Industry Icon Bob Willis
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