The High-Density Packaging User Group, the nonprofit consortium of electronics manufacturers and suppliers that collaborate on various technical problems in order to reduce cost and time to market, has nearly 25 projects underway, several of which are due to be completed this year.
We spoke this month with Madan Jagernauth, marketing director and project facilitator of HDP, about their current research on lead-free solder alloys, the recent conference Best Papers, and whether the consortium members are ready to tackle artificial intelligence.
RM 94: Dr. Ron Lasky on His Many Books
RM 93: Dr. Kunal Shah on Ni-Less ENIG
PCB Chat 96: The Latest HDP Initiatives with Jack Fisher and Madan Jagernauth
PCB Chat 95: Latest PCB ECAD Market Data with Wally Rhines
RM 92: IPC Apex Expo Conversations: Reflow Thermal Control / Automated Device Programming
RM 91: Conversations from IPC APEX Expo - Inspection Systems - Contract Assembly - and Pirates!
PCB Chat 94: Michael Kirschner on Sustainability Standards
RM 90: Mike Adamson on Component Storage
PCB Chat 93: Mack Technologies on EMS Manufacturing in Mexico
RM 89: Tombstoning Mitigation with Tony Lentz
PCB Chat 92: Dr. James Lee and Chris Banton on RIT’s PCB Design Curriculum
RM 88: Indium’s Brian O’Leary on Electric Vehicles
PCB Chat 91: Wally Rhines on the Latest ECAD Software Trends
PCB Chat 90: Travis Kelly on the PCBAA
RM 84: Christopher Frederickson on Solder Paste Inspection
PCB Chat 89: College Training Programs for Electronics
PCB Chat 88: HDP Users Group Update
C2C 12: Smart Splice Cofounder Larry Welk
RM 83: Thermal Management Expert Miles Moreau
PCB Chat 87: Jorge Cardona on EMS in Colombia
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