The High-Density Packaging User Group, the nonprofit consortium of electronics manufacturers and suppliers that collaborate on various technical problems in order to reduce cost and time to market, has nearly 25 projects underway, several of which are due to be completed this year.
We spoke this month with Madan Jagernauth, marketing director and project facilitator of HDP, about their current research on lead-free solder alloys, the recent conference Best Papers, and whether the consortium members are ready to tackle artificial intelligence.
RM 82: Paul Salerno on Soldering Materials and Selection
PCB Chat 86: Wally Rhines on the ECAD Market Data
RM 80: Cheryl Tulkoff and Greg Caswell on DfX
RM 79: Arch Systems‘ Dave Trail about Industry 4.0
PCB Chat 85: Matt Dyson on Electrically Conductive Adhesives
C2C 11: Poligage Founder and CEO Christine Davies
RM 77: James Kovacevic on Maintenance Reliability Training
RM 76 - Meet the Press
RM 75: Matric Group‘s Patrick Stimpert on Lean Manufacturing
C2C 10: Zestron‘s Dr. Harald Wack
PCB Chat 84: Gowtham Ramachandran on the ‘Desktop Microfactory‘
C2C 9: Foresite Founder Terry Munson
RM 74: Worthington Assembly's Chris Denney on Contract Manufacturing
RM 73: Solder Paste Expert Tim Jensen of Indium
PCB Chat 83: Vincent Bedat of Volthub on OEM-EMS Data Sharing
C2C 8: STI Electronics' David Raby
RM 72: Thermal Profiling with ECD's Mark Waterman
PCB Chat 82: The RIT CEMA Capstone Project Team
PCB Chat 81: Terry Jernberg of EMA on Power Integrity
C2C 7: A Conversation with Industry Icon Bob Black
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