The High-Density Packaging User Group, the nonprofit consortium of electronics manufacturers and suppliers that collaborate on various technical problems in order to reduce cost and time to market, has nearly 25 projects underway, several of which are due to be completed this year.
We spoke this month with Madan Jagernauth, marketing director and project facilitator of HDP, about their current research on lead-free solder alloys, the recent conference Best Papers, and whether the consortium members are ready to tackle artificial intelligence.
PCB Chat 80: Wally Rhines on the Latest EDA Sales Data
RM 71: Manufacturer's Reps Talk Sales and Support Post Covid-19
C2C 6: Dr. Mike Stull and Mike Konrad
RM 70: Nano Dimension Cofounder Amit Dror
PCB Chat 79: Bruce Mahler on the Ohmega-Ticer Merger
Concept to Creation 5: Datest's Robert Boguski and Regina Lathrop
PCB Chat 78: Peter Bigelow on 50 Years in PCB Fabrication
RM 69: Part 2 Mike Konrad, Chris Denney and Melissa Hough on the Pick-Place Podcast
Concept to Creation 4: Kyzen's Dr. Mike Bixenman and Tom Forsythe
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PCB Chat 76: David Bernard on X-ray Inspection
RM Episode 66: Dr. Ron Lasky and Students
Concept to Creation - The Entrepreneurs of the Electronic Assembly Industry
RM65: Tim O’Neill and Fred Dimock on Voiding, Vacuum Reflow, and Oven Profiling, Part 2
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PCB Chat 75: Keshav and Tarun Amla of Avishtech on Electronics Stackup Tools
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