Ep. 12: Product Screening with Sonix Acoustic Scanning Microscopes
Spirit: Behind the Screen

Ep. 12: Product Screening with Sonix Acoustic Scanning Microscopes

2021-04-19
How do you find a minute but costly void in wafer bonding when it may be less than 0.1 micron in size? Sonix has spent the past 3 decades developing ultrasonic testing equipment for nondestructive testing to achieve this level of inspection. Sonix acoustic imaging can analyze products to avoid failures with increasing efficiency and at smaller microscopic resolutions.   Marti talks with sales and applications engineering lead Shwetha Jakkidi about how Sonix is advancing in acoustic imaging technology and ...
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