Thermal interface materials are used for heat transfer in a variety of electronics applications.
On this episode of PCB Chat, Claire Wemp, Ph.D, a thermal applications engineer at DuPont, discusses TIM1 materials (and explains the difference between TIM1 and TIM2), when and where they are used, who specifies them, and how they work.
Wemp is also a member of the Society Women in Electronics, and in the second half of the podcast we talk about her experience in SWE, which dates to college, DuPont's role in recruiting, and how to bend the curve in attracting more women to STEM fields.
RM 131: Industry Icon Bob Willis
PCB Chat 121: Wally Rhines on the Latest Electronics Design Software Market Data
RM 130: Human-Centered Approaches to Innovation with Dr. Alexis Abramson
RM 129: Network Reliability - Avoiding Cyber-Security Threats
PCB Chat 120: HDP’s Latest PCB and Solder Research
RM 127: Phil Zarrow and Jim Hall
RM 126: Moisture Mitigation Strategies with Dan Jenkins and Rob Lowery
RM 125: DFM Best Practices with Pride Industries’ Engineering Manager Andrew Williams
RM 124: Dave Hillman’s Amazing 3,600 Mile Kayak Journey Down the Missouri River
PCB Chat 119: David Schild on US Government Investment and Policy for PCB Manufacturing
RM 123: Introduction to Highly Accelerated Life Testing (HALT) with Dr. Christopher Jackson
PCB Chat 117: July 2023 EDA Software Market Update
RM 122: The Integration of AI into Inspection Systems
PCB Chat 116: John Watson on PCB Designer Training
RM 120: Making Reliability Training Entertaining and Effective
RM 119: Quantum Mechanics Explained
PCB Chat 115: Wally Rhines on the Latest ECAD Market Data
PCB Chat 114: Matthias Wagner and Kerry Chayka of Flux
RM 118: Making ’Big Data’ Useful with Intraratio’s Ryan Gamble
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