Thermal interface materials are used for heat transfer in a variety of electronics applications.
On this episode of PCB Chat, Claire Wemp, Ph.D, a thermal applications engineer at DuPont, discusses TIM1 materials (and explains the difference between TIM1 and TIM2), when and where they are used, who specifies them, and how they work.
Wemp is also a member of the Society Women in Electronics, and in the second half of the podcast we talk about her experience in SWE, which dates to college, DuPont's role in recruiting, and how to bend the curve in attracting more women to STEM fields.
PCB Chat 105: Low-Heat Solders with Ian Tevis of SAFI-Tech and Andy Mackie of Indium
RM 105: Conformal Coating Material Selection Best Practices
PCB Chat 104: Wang Lu of Jove Enterprises
RM 104: Thomas Ricciardelli on ESD Flooring
PCB Chat 103: Stephen Chavez on Design Automation
RM 103: SMT Assembly Equipment for Low-Volume Applications
RM 102: Contract Manufacturer Selection Process Best Practices
RM 101: The Future of US Manufacturing with IPC’s Matt Kelly
RM 100: A 100th Episode Special (Recorded Live)
PCB Chat 102: Dr. Matthew Dyson on the Factory of the Future
PCB Chat 101: Brian Morrison on Smart Manufacturing
RM 99: Graham Naisbitt on IPC Cleanliness Standard Compliance
PCB Chat 100: John Burkhert Jr. on Engineering Soft Skills
RM 98: Jen Fijalkowski on Advances in Solder Pastes
PCB Chat 99: RIT PCB Design Curriculum
RM 97: Best Practices for Purchasing X-Ray Equipment
RM 96: Phil Zarrow and Jim Hall on Their New Book
PCB Chat 98: The Cadence Allegro/ Dassault Systèmes 3DExperience Integration
PCB Chat 97: Travis Kelly on the Printed Circuit Board Association of America
RM 95: SMTA SMT Certification Course Authors Dr. Ron Lasky and Jim Hall
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