Thermal interface materials are used for heat transfer in a variety of electronics applications.
On this episode of PCB Chat, Claire Wemp, Ph.D, a thermal applications engineer at DuPont, discusses TIM1 materials (and explains the difference between TIM1 and TIM2), when and where they are used, who specifies them, and how they work.
Wemp is also a member of the Society Women in Electronics, and in the second half of the podcast we talk about her experience in SWE, which dates to college, DuPont's role in recruiting, and how to bend the curve in attracting more women to STEM fields.
RM 94: Dr. Ron Lasky on His Many Books
RM 93: Dr. Kunal Shah on Ni-Less ENIG
PCB Chat 96: The Latest HDP Initiatives with Jack Fisher and Madan Jagernauth
PCB Chat 95: Latest PCB ECAD Market Data with Wally Rhines
RM 92: IPC Apex Expo Conversations: Reflow Thermal Control / Automated Device Programming
RM 91: Conversations from IPC APEX Expo - Inspection Systems - Contract Assembly - and Pirates!
PCB Chat 94: Michael Kirschner on Sustainability Standards
RM 90: Mike Adamson on Component Storage
PCB Chat 93: Mack Technologies on EMS Manufacturing in Mexico
RM 89: Tombstoning Mitigation with Tony Lentz
PCB Chat 92: Dr. James Lee and Chris Banton on RIT’s PCB Design Curriculum
RM 88: Indium’s Brian O’Leary on Electric Vehicles
PCB Chat 91: Wally Rhines on the Latest ECAD Software Trends
PCB Chat 90: Travis Kelly on the PCBAA
RM 84: Christopher Frederickson on Solder Paste Inspection
PCB Chat 89: College Training Programs for Electronics
PCB Chat 88: HDP Users Group Update
C2C 12: Smart Splice Cofounder Larry Welk
RM 83: Thermal Management Expert Miles Moreau
PCB Chat 87: Jorge Cardona on EMS in Colombia
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