Chris Nash is product manager for Indium’s PCB assembly solder paste, where works with the R&D team and provides technical advice in the selection, use, and application of solder paste and flux to electronics assembly customers throughout the world. He is also a certified Six Sigma Green Belt from Dartmouth College’s Thayer School of Engineering and a Certified SMT Process Engineer. He talks about solder paste insufficients caused by printing with PCB Chat host Mike Buetow.
RM 142: Live from SMTA's Pan Pacific Strategic Electronics Symposium (PanPac)
RM 141: Component Tape Splicing Best Practices
PCB Chat 129: Electronics Design Market Update with Wally Rhines
PCB Chat 128: The Latest HDP Consortium Projects
RM 139: Environmentally Responsible Alternatives to Traditional PCB Fabrication
PCB Chat 127: Matthias Wagner on AI-Based PCB Design Tools
RM 138: Hand Soldering and Rework Best Practices
RM 137: Building a Sustainable Career with a Sustainable Impact
PCB Chat 127: David Schild on US Strategy for Supply Chain Readiness
PCB Chat 126: Andrew Scheuermann on AI in Electronics
RM 136: Environmentally Responsible/Sustainable Conformal Coating
PCB Chat 125: Manny Marcano on Spinoff of Accelerated Designs
PCB Chat 124: Wally Rhines on the Latest PCB Design Software Market Data
RM 135: Zach Peterson about Board Design Best Practices
RM 134 -- 2023 Podcast Season Wrap-Up
RM 133: Novel Wireless / Wearable ESD Monitoring
PCB Chat 123: US PCB Legislation Update with David Schild of PCBAA
PCB Chat 122: Robert Feranec on PCB Design
RM 132: HZO’s Lisa Rizzo on Ultra-Thin Conformal Coating
RM 131: Industry Icon Bob Willis
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