Chris Nash is product manager for Indium’s PCB assembly solder paste, where works with the R&D team and provides technical advice in the selection, use, and application of solder paste and flux to electronics assembly customers throughout the world. He is also a certified Six Sigma Green Belt from Dartmouth College’s Thayer School of Engineering and a Certified SMT Process Engineer. He talks about solder paste insufficients caused by printing with PCB Chat host Mike Buetow.
RM 89: Tombstoning Mitigation with Tony Lentz
PCB Chat 92: Dr. James Lee and Chris Banton on RIT’s PCB Design Curriculum
RM 88: Indium’s Brian O’Leary on Electric Vehicles
PCB Chat 91: Wally Rhines on the Latest ECAD Software Trends
PCB Chat 90: Travis Kelly on the PCBAA
RM 84: Christopher Frederickson on Solder Paste Inspection
PCB Chat 89: College Training Programs for Electronics
PCB Chat 88: HDP Users Group Update
C2C 12: Smart Splice Cofounder Larry Welk
RM 83: Thermal Management Expert Miles Moreau
PCB Chat 87: Jorge Cardona on EMS in Colombia
RM 82: Paul Salerno on Soldering Materials and Selection
PCB Chat 86: Wally Rhines on the ECAD Market Data
RM 80: Cheryl Tulkoff and Greg Caswell on DfX
RM 79: Arch Systems‘ Dave Trail about Industry 4.0
PCB Chat 85: Matt Dyson on Electrically Conductive Adhesives
C2C 11: Poligage Founder and CEO Christine Davies
RM 77: James Kovacevic on Maintenance Reliability Training
RM 76 - Meet the Press
RM 75: Matric Group‘s Patrick Stimpert on Lean Manufacturing
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