Design Reliable Multiple Stack Microvias Like a Pro

Gerry Partida is a 36 year veteran of the PCB industry, and spent twenty of those years working in boardshops. He is currently a Senior Field Application Engineer for Summit Interconnect, where he and his colleagues have made a fascinating discovery about the reliability of multiple stacked microvias. Gerry and his team are still collecting data on this finding, but he joined us on OnTrack to share a firsthand account of what he knows!

Work from Anywhere. Connect with Anyone.

Watch the video, click here.

Show Highlights:

• Gerry shares his industry background and introduces Summit Interconnect, the second largest printed circuit board manufacturer in North America.
• What is a microvia? A manufacturer’s perspective.
• The first step is recognizing there’s a problem: a brief overview of the issue with multiple (more than two) stacked microvias.
• To boldly go where no one has gone before: In the absence of an IPC standard, Gerry shares the recommended distance between stacked microvia and mechanically drilled holes. 
• Gerry’s advice on how to avoid overloading your designs.
• Gerry discusses IPC-6012E and the need for performance testing in the absence of adequate scopes (over 500x). 
• OM testers: What are they, how prevalent are they, and how can they add value to your company?
• OM testing: Reflow simulation and thermal shock testing—its value and its scope. 

Links and Resources:

Gerry Partida on LinkedIn
Summit Interconnect
IPC-6012E

 

Now you can get the ultimate PCB design productivity with the easiest platform for PCB design. Easily communicate design changes to your team with Altium 365. 

Work from Anywhere. Connect with Anyone.