What do Moore’s Law, the Von Neuman Bottleneck, and alpha-band brain activity have in common?! This week’s episode of Amelia’s Weekly Fish Fry! Matthew Burns (Samtec) joins us to discuss how we can prepare for the next wave of high speed fabrics in embedded computing and why these new faster fabrics will make our design lives harder not easier. Also this week, we take a closer look at new research that contends that human brain waves respond to changes in Earth-strength magnetic fields.
The Fantastic Road Forward: The Future of 3D IC Design and the Discovery of Self-Replicating Living Robots
Fish Fry Special Edition: Makers Today! OKdo
The Indy Autonomous Challenge
Superhuman Code, Semantic Analyzers and Automated Debugging: How Machine Programming Will Change the Future of Electronic Engineering
Every Breath You Take: Imec and miDiagnostics Launch a Revolutionary Breathalyzer Test for COVID-19 and Beyond
Learning Reality: Seoul Robotics’ 3D Perception Software with Deep Learning and Cell Variability May Unlock AI Learning
The Future of IoT As We Know It - How Multi-Technology Collaboration will Shape the Next Wave of IoT Innovation
Fish Fry Special Edition: Makers Today! Dr. Duino
The Challenges of On-Device AI Development and Yes, AI Can Predict the Rain Better than the Weatherman
Eyes on the Prize: element14’s Spy Nerd Challenge and MIT’s New Robot Finds Lost Items
AI‘s Next Giant Leap: How Intel is Advancing the Neuromorphic Computing Revolution
Chips, Chiplets, and Modules, Oh My!
Fish Fry Special Edition: Makers Today! Art by Physicist
Adventures in Memory - Samsung’s HBM-PIM and A New Brain-Inspired Memory Device
FloatingPoint DSP for You and Me: Why Today’s Real World Designs Need FloatingPoint Digital Signal Processing
Taking Piracy out of the Driver’s Seat
Crafting the Next Generation of AI - Deci is Looking to Change How We Build Artificial Intelligence
Fish Fry Special Edition: Makers Today! Max Maxfield
Building a Bridge Between Technology and Diplomacy: The Purdue Research Foundation Launches the Center for Tech Diplomacy at Purdue
Papa’s Got a Brand New Node: Intel Makes Waves in Process and Packaging
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