Hosts Bryan Goldstein, President- Analog Devices Federal and Vice President Aerospace and Defense Group at Analog Devices, and Sean Darcy, Sr. Director Aerospace and Defense at Infineon talk with special guest, John Park, Product Management Group Director for IC packaging and cross-platform solutions at Cadence Design Systems, about the challenges of heterogeneous integration, how it compares to SoC and 3D packaging, and the future of this technology for the semiconductor industry. Visit Analog Devices A&D webpage for solutions to your design challenges.
RF Industries Interview: New RF Transparent Concealment Material
Evolution of Radar: Interview with Jerome Patoux of Analog Devices
Market Trends and Design Advice for Switching Systems in Testing Automation
Frequency Matters, July 8: Annual Beach Episode, Software/Design Issue and IMS 2022
Challenges in Hypersonics: Interview with Times Microwave
Learn About Altair FEKO 2022 Enhancements: Interview with Brian Woods, VP of EM Solutions
Frequency Matters June 17: Semi/A&D issues, Altair Interview, News and IMS2022
RF Industry Icon: Joel Dunsmore, Research Fellow at Keysight Technologies
Frequency Matters, June 3: Semiconductor Issue, Mini-Circuits Interview, Industry News/IMS2022
Unique LTCC Products and Market Overview: Mini-Circuits Interview
Samtec Interview: Learn About Wideband RF Launch Design Challenges and Solutions
ADI Interview: 5G mmWave Market Overview and Product Differentiation
Frequency Matters, May 20: 5G/IMS Issue Products, ADI Interview, News, IMS2022 Exhibition
The Case for a Common, Modular 5G FR1 Small Cell Architecture
RF Industry Icon: Sir Christopher Snowden, University & Industry Leader and FET Modeling Pioneer
Satellite Market Overview and Importance Power Supply Design
Frequency Matters, May 9: 5G/IMS Issue, Industry News, Events
Sherry Hess of Cadence Shares Exciting Applications Enabled by Their System Analysis Solutions
Magneto Ceramic Based RF and Microwave Components Poised to Make a Quantum Leap
Ericsson discusses Motivation for NSF’s $37 Million Funding for 6G Research
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