Hosts Bryan Goldstein, President- Analog Devices Federal and Vice President Aerospace and Defense Group at Analog Devices, and Sean Darcy, Sr. Director Aerospace and Defense at Infineon talk with special guest, John Park, Product Management Group Director for IC packaging and cross-platform solutions at Cadence Design Systems, about the challenges of heterogeneous integration, how it compares to SoC and 3D packaging, and the future of this technology for the semiconductor industry. Visit Analog Devices A&D webpage for solutions to your design challenges.
Frequency Matters, Sept 15: Automotive Issue, Mini-Circuits Interview, News/Events
State of the SATCOM Market - Interview with Analog Devices’ Bob Broughton
Audi and PeachTree Corners Collaborate on C-V2X Project
Learn About Gapwaves Low Loss Antenna Technology
Frequency Matters, Aug 25: EuMW/mmWave Issue, Gapwaves Interview, News/Events
Surprising Capabilities of MATLAB and Simulink - A Powerful Combination
B&S on Aerospace and Defense, Episode 6: Phased Array Design and Test Challenges
Frequency Matters, Aug 11: EuMW/mmWave issue, Industry News/Events
How Space Startups are Using Additive Manufacturing to Build Better Systems
Analog Devices Interview: New Wideband Mixed Signal Front End Platform, Apollo MxFE
Frequency Matters, July 28: Software/Design Products, ADI Interview, Industry News/Events
Cables for Space: Interview with Times Microwave
Frequency Matters, July 14 - Beach Episode: Software/Design Issue, News/Events
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Learn About Ambient IoT Coming in Release 19 of 5G
Frequency Matters, June 23: Semiconductor Issue Products, Industry News, IMS 2023 Wrap Up
Satellite and Commercial Space Outlook: Interview with Mini-Circuits
Frequency Matters, June 8: Semiconductor Issue, Mini-Circuits Interview, News & Events
The First MEMS Switches Introduced Into Switching Matrices
The State of the Global Chip Supply and Demand
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