Conductive anodic filament (CAF) is a form of electrochemical migration (ECM). Unlike surface-level ECM, CAF exists beneath the surface of the circuit assembly. Graham and Mike Konrad discuss the causes of CAF and methods to test for and mitigate CAF.
Graham has an extensive history working in the electrical and electronic manufacturing industry. Graham was the IEC 1906 Lord Kelvin Award Winner. IEC TC91 WG2, 3 and 10 Maintenance Leader of 4 Standards. He is vice chair of the IPC 5-30 Cleaning and Coating Sub-Committee overseeing 15 IPC Standards Development Committees. He has received 14 IPC Standards Awards and is a BSI British Standards Institution (EPL501) Member.
Graham is a Specialist in Insulation Resistance Testing, Ionic Contamination Control, Solderability, Conformal Coating materials and application systems, including Cleaning, Inspection and Test.
RM 106: A Conversation about Production Automation
PCB Chat 105: Low-Heat Solders with Ian Tevis of SAFI-Tech and Andy Mackie of Indium
RM 105: Conformal Coating Material Selection Best Practices
PCB Chat 104: Wang Lu of Jove Enterprises
RM 104: Thomas Ricciardelli on ESD Flooring
PCB Chat 103: Stephen Chavez on Design Automation
RM 103: SMT Assembly Equipment for Low-Volume Applications
RM 102: Contract Manufacturer Selection Process Best Practices
RM 101: The Future of US Manufacturing with IPC’s Matt Kelly
RM 100: A 100th Episode Special (Recorded Live)
PCB Chat 102: Dr. Matthew Dyson on the Factory of the Future
PCB Chat 101: Brian Morrison on Smart Manufacturing
RM 99: Graham Naisbitt on IPC Cleanliness Standard Compliance
PCB Chat 100: John Burkhert Jr. on Engineering Soft Skills
RM 98: Jen Fijalkowski on Advances in Solder Pastes
PCB Chat 99: RIT PCB Design Curriculum
RM 97: Best Practices for Purchasing X-Ray Equipment
RM 96: Phil Zarrow and Jim Hall on Their New Book
PCB Chat 98: The Cadence Allegro/ Dassault Systèmes 3DExperience Integration
PCB Chat 97: Travis Kelly on the Printed Circuit Board Association of America
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