On this show, we’ve discussed many aspects of the electronics assembly process. We talked about reflow, thermal management, printing, soldering materials, additives, and so much more. What do all these topics have in common? When done correctly, they all contribute to the reliability of circuit assemblies.
Today, we’re going to dive into the subject of cleaning circuit assemblies after reflow. For many assemblers, the cleaning process was replaced by the use of no clean flux technology. Time and technology have eroded the concept of allowing all residues to remain on the assembly. Today, residue caused failures are such a concern, that IPC recently and radically changed the way circuit assemblies are considered to be clean.
Mike Konrad's guests are Sal Sparacino and Eric Camden. Sal is sirector of sales at Zestron Americas, located in Manassas, VA. Zestron is a manufacturer of cleaning chemicals for the electronics industry. Eric is lead investigator for Foresite, an analytical laboratory based in Kokomo IN. Eric, is the person you call when things go wrong. Together with my experience as a cleaning equipment manufacturer, we’ll discuss how cleaning contributes to increased reliability, and we’ll review the reasons cleaning has returned as a mainstream assembly process.
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PCB Chat 105: Low-Heat Solders with Ian Tevis of SAFI-Tech and Andy Mackie of Indium
RM 105: Conformal Coating Material Selection Best Practices
PCB Chat 104: Wang Lu of Jove Enterprises
RM 104: Thomas Ricciardelli on ESD Flooring
PCB Chat 103: Stephen Chavez on Design Automation
RM 103: SMT Assembly Equipment for Low-Volume Applications
RM 102: Contract Manufacturer Selection Process Best Practices
RM 101: The Future of US Manufacturing with IPC’s Matt Kelly
RM 100: A 100th Episode Special (Recorded Live)
PCB Chat 102: Dr. Matthew Dyson on the Factory of the Future
PCB Chat 101: Brian Morrison on Smart Manufacturing
RM 99: Graham Naisbitt on IPC Cleanliness Standard Compliance
PCB Chat 100: John Burkhert Jr. on Engineering Soft Skills
RM 98: Jen Fijalkowski on Advances in Solder Pastes
PCB Chat 99: RIT PCB Design Curriculum
RM 97: Best Practices for Purchasing X-Ray Equipment
RM 96: Phil Zarrow and Jim Hall on Their New Book
PCB Chat 98: The Cadence Allegro/ Dassault Systèmes 3DExperience Integration
PCB Chat 97: Travis Kelly on the Printed Circuit Board Association of America
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