The clock is ticking. The time to design in the next generation of vehicle-to-vehicle communication is now. In this week’s Fish Fry, we navigate through the twists and turns that V2V communications have in store for us. My guest Kim Rubin and I discuss how the issues surrounding security, privacy, and accuracy are going to be crucial to widespread V2V implementation in the next couple years. Keeping on track with our vehicular theme this week, we also check out new self-repairing asphalt technology (from Delft University in the Netherlands) that could charge our electric cars and fix our pothole problems at the same time.
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Links for May 12, 2017
More information about Vehicle-to-Vehicle Communication Implementation (NHTSA)
Have scientists discovered the cure for potholes? (Article)
AI Everywhere (and for Everyone): Intel Builds A Bridge Between Data and Insight
The Speed of Iteration is the Speed of Innovation: How Groq is Accelerating Design Creation
5G and Laying the Foundation for the Next Generation of Wireless Communication
The Pursuit of Performance: How AI can Help Optimize Electronic System Design
Seeds for a New Day: Edge ML, Evolution of IoT and Artificial Leaves that Generate Clean Fuel
Re-Inventing Home Security: Infineon’s New AI/ML-based Smart Alarm System
Cloud First! Leveraging the Cloud for Your System Design
One Size Does Not Fit All: The Rise of Bespoke Silicon
U Can Touch This! BeBop Sensors Brings a Sense of Touch to Robots and More!
The Next Wave of Semiconductor Innovation
Fast Times in Supply and Demand: How the EDDI Report Can Help Determine How Difficult Sourcing Will Be
Faster AI! Go! Go!
The Currency of Data: Liquid Instruments’ Innovative Take on Software Defined Instrumentation
The Road Forward for IoT: Cellular, LoRa, and WiFi - Oh My!
Sowing the Seeds of Change: How Sustainability and Extending Product Life Cycles Can Help Ease Our Supply Chain Woes
Let’s Just Fly There! How the Center for Autonomous Vehicles in Air Transportation Engineering is Charting a Course for Flying Taxis
Let’s Get Spaced Out! New Space-Qualified FRAM and the Discovery of New Black Holes
AI to Save the Day: Athinia Uses Artificial Intelligence and Big Data to Help Solve Semiconductor Challenges
Opening the Door for Manufacturing Innovation: PulseForge Develops a New Form of Thermal Processing
Shaving Hairs and New Electronics: UChicago’s Nanocrystal Breakthrough
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