Sub-25 Micron Traces with Averatek ASAP Technology

2021-07-13

High-density designs, simplified. Averatek offers a disruptive solution for complex electronic design. We are very fortunate to have the powerhouse executive team from Averatek Corporation, a company that develops and licenses advanced manufacturing processes for a variety of electronic products including very high density printed circuit boards, semiconductor packaging, and RF and millimeter-wave electronics. Haris Basit, Averatek’s CEO together with Mike Vinson the COO, and Tara Dunn the VP of Business Development and Marketing will share with us some exciting breakthroughs in mi...

High-density designs, simplified. Averatek offers a disruptive solution for complex electronic design.

We are very fortunate to have the powerhouse executive team from Averatek Corporation, a company that develops and licenses advanced manufacturing processes for a variety of electronic products including very high density printed circuit boards, semiconductor packaging, and RF and millimeter-wave electronics.

Haris Basit, Averatek’s CEO together with Mike Vinson the COO, and Tara Dunn the VP of Business Development and Marketing will share with us some exciting breakthroughs in miniaturization technology.

Altium 365: Where the World Designs Electronics

Watch the video, click here.

Show Highlights:

Introductions, and Averatek Technology Overview
- Founded out of SRI in Silicon Valley
- PCB Industry in North America is ripe for disruption
Definitions: MSAP, ASAP and Subtractive processes
- ASAP is Averatek semi-additive process and is achieved with a liquid metal ink catalyst and plated up from the seed layer
PCB design benefits of Averatek technology
- Simplify the design
- Reduction in number of layers and lamination cycles
- Increased density and miniaturization
- Signal integrity improvements
- Applications are military, medical and communications
Material suitable for ASAP high-performance design:
- Epoxy-based substrates
- High-frequency materials (including Teflon)
- High-speed materials
- Some flex materials
- Thin materials
Shorten the learning curve for PCB designers with Tomas Chester design project in partnership with Averatek coming soon on Altium Resource Hub
Example design optimization:
- Smaller footprint, increased panel usage
- 12 layer board became 8 layer board
- 3 lamination cycle to 1 lamination cycle
- Simplified design, increased reliability, significantly lower costs