In this week’s episode of Fish Fry, we are headed to the smallest of the small process geometries: 2nm! My guest Ruben Molina (Synopsys) and I are talking about how exactly we are going to get started with these tiny process nodes and how technical advisory boards are driving the charge toward standardization and process architecture specification. Also this week, we take a closer look at the world’s first mobile skin bioprinting system unveiled by the Wake Forest Institute for Regenerative Medicine.
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Links for March 8, 2019
Industry Leaders Collaborate with Synopsys on Modeling Standards to Address Design Down to 2nm
Mobile Bedside Bioprinter Can Heal Wounds (Wake Forest School of Medicine)
Whitepaper: In Situ Bioprinting of Autologous Skin Cells Accelerates Wound Healing of Extensive Excisional Full-Thickness Wounds
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Fish Fry Executive Interviews
Anupam Bakshi, CEO – Agnisys
Dave Kleidermacher, CTO – Green Hills Software
Robert Blake, CEO – Achronix
Jack Harding, CEO – eSilicon
Michiel Ligthart, COO – Verific
Adnan Hamid, CEO – Breker Technologies
Simon Davidmann, CEO – Imperas
Ted Miracco, CEO – SmartFlow Compliance Solutions
Jessica Gomez – Rogue Valley Microdevices
Shishpal Rawat, Chairman – Accellera Systems Initiative
Kevin Bromber, CEO – myDevices
Daniel Hansson, CEO – Verifyter
Mark Papermaster, CTO – AMD
David Fried, CTO – Coventor
Dr. Steven LeBoeuf, President – Valencell
David Dutton, CEO – Silvaco
Bob Niemiec, CEO – TwistThink
Allan Martinson, COO – Starship Technologies
Zhihong Liu, Chairman and CEO – ProPlus Solutions
Taher Madraswala, CEO and President – Open-Silicon
Kapil Shankar, CEO and Director – AnDAPT
Dan Fox, CTO – Local Motors
Kim Rowe, Founder and CEO — RoweBots
Lawrence Cooke, Founder and CEO — NovaSolix
Gregg Recupero, CTO — Performance-IP
Alan Grau, CEO — Icon Labs
Carl Alberty, Vice President – Cirrus Logic
Maximilian Odendahl, CEO — Silexica
Finbarr Moynihan, General Manager — MediaTek
Sanjay Pillay, CEO — Austemper
Louis Parks, CEO – SecureRF
Harold Blomquist, CEO – Helix Semiconductor
Dale Dougherty and Sherry Huss, Co-Founders – Maker Faire
Mike Wisart, CEO – efabless
Chris Giovanniello, SVP and Co-Founder – Menlo Micro
Jake Janovetz, President – Opal Kelly
Jerry Gipper, Executive Director – VITA
Ethan Plotkin, CEO – GDCA
Xin Song, CEO - Bottos
Chris Dries, CEO – UnitedSiC
Bob Smith, Executive Director - ESD Alliance
Rick O'Connor, Executive Director - RISC V Foundation
Naveed Sherwani, CEO and Yunsup Lee, CTO/Founder- SiFIve
Doug Letcher, CEO and President – Metrics Technologies
Jun Pei, CEO – Cepton Technologies
Nikos Zervas, CEO of CAST
The Fantastic Road Forward: The Future of 3D IC Design and the Discovery of Self-Replicating Living Robots
Fish Fry Special Edition: Makers Today! OKdo
The Indy Autonomous Challenge
Superhuman Code, Semantic Analyzers and Automated Debugging: How Machine Programming Will Change the Future of Electronic Engineering
Every Breath You Take: Imec and miDiagnostics Launch a Revolutionary Breathalyzer Test for COVID-19 and Beyond
Learning Reality: Seoul Robotics’ 3D Perception Software with Deep Learning and Cell Variability May Unlock AI Learning
The Future of IoT As We Know It - How Multi-Technology Collaboration will Shape the Next Wave of IoT Innovation
Fish Fry Special Edition: Makers Today! Dr. Duino
The Challenges of On-Device AI Development and Yes, AI Can Predict the Rain Better than the Weatherman
Eyes on the Prize: element14’s Spy Nerd Challenge and MIT’s New Robot Finds Lost Items
AI‘s Next Giant Leap: How Intel is Advancing the Neuromorphic Computing Revolution
Chips, Chiplets, and Modules, Oh My!
Fish Fry Special Edition: Makers Today! Art by Physicist
Adventures in Memory - Samsung’s HBM-PIM and A New Brain-Inspired Memory Device
FloatingPoint DSP for You and Me: Why Today’s Real World Designs Need FloatingPoint Digital Signal Processing
Taking Piracy out of the Driver’s Seat
Crafting the Next Generation of AI - Deci is Looking to Change How We Build Artificial Intelligence
Fish Fry Special Edition: Makers Today! Max Maxfield
Building a Bridge Between Technology and Diplomacy: The Purdue Research Foundation Launches the Center for Tech Diplomacy at Purdue
Papa’s Got a Brand New Node: Intel Makes Waves in Process and Packaging
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