Wafer Mapping Sensor for Precision in the Smallest Spaces

Henry and Jack discuss Balluff’s new wafer mapping sensor: BOH00EZ. utilizes a highly precise photoelectric sensor for quick and reliable detection of semiconductor wafers and slotting errors in FOUPS – front opening unified pods. Especially designed for use with extremely thin end effectors, it features an extremely controlled and focused light spot, allowing it to detect wafers even just a few μm thick with extreme precision.

Copyright 2019