What has SLAM done for you lately? If you are working on a vision processing application, quite a lot most likely! In this week’s episode of Fish Fry, we welcome Pulin Desai from Cadence Design Systems. Pulin and I chat about the trends driving the need for more vision processing, the current challenges associated with SLAM (simultaneous localization and mapping) and when he thinks it is best to use an AI accelerator in your next vision of artificial intelligence design. Also this week, we check out how a multinational team of research scientists have created the first IC that can emulate the structure of the brain with artificial synapses the a little help from optogenetics.
The Fantastic Road Forward: The Future of 3D IC Design and the Discovery of Self-Replicating Living Robots
Fish Fry Special Edition: Makers Today! OKdo
The Indy Autonomous Challenge
Superhuman Code, Semantic Analyzers and Automated Debugging: How Machine Programming Will Change the Future of Electronic Engineering
Every Breath You Take: Imec and miDiagnostics Launch a Revolutionary Breathalyzer Test for COVID-19 and Beyond
Learning Reality: Seoul Robotics’ 3D Perception Software with Deep Learning and Cell Variability May Unlock AI Learning
The Future of IoT As We Know It - How Multi-Technology Collaboration will Shape the Next Wave of IoT Innovation
Fish Fry Special Edition: Makers Today! Dr. Duino
The Challenges of On-Device AI Development and Yes, AI Can Predict the Rain Better than the Weatherman
Eyes on the Prize: element14’s Spy Nerd Challenge and MIT’s New Robot Finds Lost Items
AI‘s Next Giant Leap: How Intel is Advancing the Neuromorphic Computing Revolution
Chips, Chiplets, and Modules, Oh My!
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Adventures in Memory - Samsung’s HBM-PIM and A New Brain-Inspired Memory Device
FloatingPoint DSP for You and Me: Why Today’s Real World Designs Need FloatingPoint Digital Signal Processing
Taking Piracy out of the Driver’s Seat
Crafting the Next Generation of AI - Deci is Looking to Change How We Build Artificial Intelligence
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Building a Bridge Between Technology and Diplomacy: The Purdue Research Foundation Launches the Center for Tech Diplomacy at Purdue
Papa’s Got a Brand New Node: Intel Makes Waves in Process and Packaging
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