Gerry Partida on Wrap Plating
OnTrack: The PCB Design Podcast

Gerry Partida on Wrap Plating

2019-07-31
Gerry Partida is back to talk to us about wrap plating and via filling and what the benefits, requirements and drawbacks of this technology are, and what you need to know about designing these and how this technology drives cost. Show Highlights:  Gerry is the Director of Engineering at Summit Interconnect with 35 years’ experience in the PCB industry, of which he spent 2 decades in boardshops.  Were there indicators in your youth that you would end...
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