On the Line with...

Optimize the Interconnect: Wrapping Up OTI

In a thoughtful conclusion to the series, Kuldip Johal connects the key themes, examining market drivers, the technological implications of semiconductor advances, and strategies for aligning PCB production with evolving market demands.

How does Ultra HDI benefit: Routing Capabilities

American Standard Circuits' John Johnson details how the new capabilities in UHDI can fundamentally change what it means to design for manufacturability.

Meet the Co-Author of Low-temperature Soldering, Volume 2

Because solder formulations have been enjoying rapid development in the low-temperature solder arena, co-author Pritha Choudhury, senior R&D scientist with MacDermid Alpha, joins Nolan Johnson to discuss the update to The Printed Circuit Assembler's Guide to Low- temperature Soldering. Topics covered include details on key performance traits in low-temperature solder, and Choudhury shares her recommended low-temperature soldering solution.

How Ultra HDI Benefits RF Performance

John Johnson leads the way straight into UHDI's benefits to RF style design.

Ultra HDI - What does it mean to people, why would they want it?

To launch this series, ASC's John Johnson introduces us to ultra-high-density interconnect. Johnson sets the agenda for further discussion by sharing practical reasons why UHDI could be key to your next design challenge, and why both designers and the manufacturing chain are excited by UHDI's potential.