Optimize the Interconnect: MKS' ESI's role in OTI
Laser via drilling is a critical process window for MKS's Optimize the Interconnect concepts. Casey Kruger joins the podcast to explain exactly how the CO2 laser technology has been harnessed to create more accurate vias, faster, and in a smaller, more energy-efficient footprint.
Optimize the Interconnect: Understanding How Chemistry and Drilling Collaborate for OTI
MKS' Atotech's Frank Bruening and Roger Massey join us to discuss the emerging complexities in achieving optimal interconnect, and the key role chemistry plays. Their examples of the interplay between laser drilling, the chemical makeup of the substrate layers, and the plating process are worth a listen.
Optimize the Interconnect: OTI —Why it Matters
We continue our conversation with Chris Ryder on the Optimize the Interconnect(SM) concept. Chris shares some specific examples and details how and why industry leaders are adopting the OTI approach.
Meet the Author: Encapsulating Sustainability for Electronics author (MacDermid Alpha)
Beth Turner joins the podcast to discuss her book, The Printed Circuit Assembler's Guide to Encapsulating Sustainability for Electronics. The conversation ranges from the most common encapsulation materials used, to when and why to use them. Turner points out that encapsulation materials are also experiencing a creative time with respect to both performance and sustainability. A must-read for anyone with a role in specifying or applying encapsulation materials.
Optimize the Interconnect: OTI—What is OTI?
OTI, or "optimize the interconnect," is a concept approach to producing higher quality, higher complexity PCB products. Chris Ryder, MKS Director of Business Development, introduces the concept and sets the stage for a more detailed discussion.