The High-Density Packaging User Group, the nonprofit consortium of electronics manufacturers and suppliers that collaborate on various technical problems in order to reduce cost and time to market, has nearly 25 projects underway, several of which are due to be completed this year.
We spoke this month with Madan Jagernauth, marketing director and project facilitator of HDP, about their current research on lead-free solder alloys, the recent conference Best Papers, and whether the consortium members are ready to tackle artificial intelligence.
PCB Chat 75: Keshav and Tarun Amla of Avishtech on Electronics Stackup Tools
RM Episode 63: A Conversation with Reliability Expert Dock Brown
RM Episode 62: A Conversation with Cogiscan's Co-Founder François Monette
PCB Chat 74: DuPont's Andy Kannurpatti
RM Special Edition: A Conversation with IPC Chief Technologist Matt Kelly about IPC Apex
RM 61: A Conversation with Flex Circuit and Additive Electronics Expert Tara Dunn
PCB Chat 73: AJ Incorvaia on Desktop PCB Software
RM 60: Collins' Dave Hillman about Solder Voiding
PCB Chat 72: Matt Wrosch on Transient Liquid Phase Sintering
RM Episode 59: CMOS Inventor Dr. Eric Fossom
PCB Chat 71: Is the US Ready for Smart Manufacturing?
RM 58: 2020 Round-Up
PCB Chat 70: Kent Balius on Front-End Engineering
RM 57: A Conversation with CAF Expert Graham Naisbitt
PCB Chat 69: Manny Marcano on Changes in the Mainstream PCB CAD Market
RM 56: A Conversation about Solder Voiding with Solder Materials, Stencil, and Cleaning Experts
RM 55 - A Conversation with SMTA President Dr. Martin Anselm
PCB Chat Episode 68: The IPC-2581 Consortium on Electronics Data Transfer
PCB Chat Episode 67: Brad Griffin of Cadence on EMI Simulation Tools
Reliability Matters Episode 54: A Conversation with Michael Ford about Digital Twin
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