The Next Wave of Semiconductor Innovation

In this week’s Fish Fry, we are talking about electrostatic multi-nozzle printing technology, industrial microfabrication, and life-like lasers! Walter Braun (COO – Scrona) and I investigate the biggest challenges facing the microfabrication industry today, why Walter believes that the next wave of semiconductor innovation will rely on novel semiconductor packaging, and the details of Scrona’s multi-nozzle printing technology. Also this week, I examine new self-organizing lasers built by a team of researchers from Imperial College London and University College London that could lead to new materials for sensing, computing, light sources, and displays.