It seems today, the entire world is experiencing supply chain challenges in nearly all product categories. In the electronics assembly industry, the focus has been within the semiconductor market, especially in North America. Why is this? How did the US allow this to occur? Was it shortsightedness, greed, an overreliance on foreign suppliers, other factors, or a combination of all these factors? What would it take to finally address this issue and are we doing anything about it?
My guest today is Matt Kelly, chief technologist at IPC. IPC recently published a report on the chip shortage and, perhaps most importantly, came up with a list of 28 recommendations our industry can consider to remedy this issue. Matt is focused on driving next-generation technology advancements and supply chain transformation across the electronics industry. He works within the association’s executive leadership team to identify and develop new strategic initiatives, meeting member and industry needs. He delivers influential thought leadership, research, and advocacy to industry and governments. He leads IPC’s Chief Technology Council to continually drive the electronics industry forward. His focus areas include Industry 4.0 – Factory of the Future digitization, modernization, adoption, and implementation; IPC expansion into new advanced packaging technologies including IC-substrates and OSAT manufacturing; and next generation electronic systems design methods.
When I first met Matt he was with IBM. Matt comes to IPC following a 15-year career at IBM, holding several senior technology and engineering leadership positions within IBM Systems Division. His technical contributions include 25 patents, 85 publications, and numerous industry awards.
Matt is a licensed Professional Engineer with a degree in chemical engineering from McMaster University and holds an MBA in strategic management from Sir Wilfrid Laurier University.
RM 116: Supply Chain Musings with Mark Godwin of Ventec
PCB Chat 113: David Schild of the Printed Circuit Board Association of America
PCB Chat 112: Vivek Bansal on VVDN’s Vertical Integration Model
PCB Chat 111: Metallic Resources on Reclaiming Electronics Solder
RM 115: Making Sense of ’Big Data’
PCB Chat 110: Steve Robinson of APCT
RM 114: The Remarkable Return of the Post-Reflow Cleaning Process
RM 113: Counterfeit Component Detection with Dr. Eyal Weiss
Business Challenges with STI Electronics’ President David Raby
PCB Chat 109: Wally Rhines on the PCB Design Software Market
PCB Chat 108: Travis Kelly on Government Support of the US PCB Industry
RM 112: ESD Mitigation with ESD Expert Christopher Almeras
RM 111: Liquid Metal’s Potential Future in Electronics
RM 109: A Decade of Industry 4.0 - What it Was - What it Wasn’t
PCB Chat 107: Valentina Ratner and Kyle Dumont of AllSpice
PCB Chat 106: Madan Jagernauth on the Latest HDP Projects
RM 108: SMTA Pan Pacific Microelectronics Symposium Preview
RM 107: IPC Validation Services & the Trusted Supplier Program
RM 106: A Conversation about Production Automation
PCB Chat 105: Low-Heat Solders with Ian Tevis of SAFI-Tech and Andy Mackie of Indium
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