Thermal interface materials are used for heat transfer in a variety of electronics applications.
On this episode of PCB Chat, Claire Wemp, Ph.D, a thermal applications engineer at DuPont, discusses TIM1 materials (and explains the difference between TIM1 and TIM2), when and where they are used, who specifies them, and how they work.
Wemp is also a member of the Society Women in Electronics, and in the second half of the podcast we talk about her experience in SWE, which dates to college, DuPont's role in recruiting, and how to bend the curve in attracting more women to STEM fields.
Reliability Matters Episode 7 - A Conversation with ITM Consulting's Phil Zarrow and Jim Hall
PCB Chat Episode 33: Josh Ewing of Bright Machines
Reliability Matters: Doug Pauls on IPC J-STD-001G Amendment 1
The Week Today - Feb. 25 - Mar. 1, 2019
PCB Chat Episode 32: Eric Schneider
Reliability Matters: An Interview with Dr. Craig Hillman - Design for Reliability
The Week Today - Feb. 11-15, 2019
Reliability Matters: Improving Reliability of Circuit Assemblies in Harsh Environments
The Week Today - Feb. 4-8, 2019
Reliability Matters - An Interview with Johns Hopkins' APL Engineer Wendy Casker
The Week Today - Jan. 28 - Feb. 1, 2019
PCB Chat Episode 31: Sue Mucha
The Week Today, Jan. 21-25, 2019
When Failure Happens - An Interview with Failure Analysis Investigators
The Week Today - Jan. 14 -18, 2019
The Week Today - Jan. 7-11, 2019
PCB Chat Episode 30: ESD Alliance Q3 Report with Wally Rhines
The Week Today - Dec. 31, 2018 - Jan. 4, 2019
PCB Chat: The Screw-Ups, Episode 1
Reliability Matters Episode 1 - An Interview with SMT Guru Bob Willis
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