This week's podcast is all about the future of 3D IC tools and methodologies and the newest advancement in xenobot research. Vinay Patwardhan (Cadence Design Systems) and I discuss the challenges engineers experience when designing 3D chips, where existing 3D-IC tools and methodologies fall short, and what type of analysis we need for a 3D stack system as opposed to a standard chip design. Also this week, I investigate how a group of researchers from the University of Vermont, Tufts University, and the Wyss Institute for Biologically Inspired Engineering at Harvard University have discovered a brand new form of biological reproduction and how they used this new discovery to create the world’s first self-replicating living robots.
Survival of the Fittest
From Chip to City and Back Again
Seeing is Believing
Swimming in the SoC
Accelerating AI at the Edge
EDA Escapade
The Next Generation of Engineering
Up Where We Belong
Help One, Help Many
DAC At It (Again)
Communication’s Third Wave
Drones, Dragons and Data Centers
Reliability’s Road
The Communication Super Highway
Backward Balance Board
When the Undecidable Becomes Decided
The Curious Case of the Critical Catalyst
Avoiding IoT Purgatory
The Art of (Rugged) Communication
Wheels Up!
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