Verdant Electronics founder and president Joe Fjelstad has more than 40 years of international experience in electronic interconnection and packaging technology in a variety of capacities from chemist to process engineer and from international consultant to CEO. A well-known author and magazine columnist writing on the subject of electronic interconnection technologies, he has more than 180 US patents and another 100-plus international ones to his name. Prior to founding Verdant, Joe co-founded SiliconPipe, a leader in the development of high speed interconnection technologies. He was also formerly with chip-scale package developer Tessera, where he was appointed to the first corporate fellowship for his innovations. Joe speaks with Mike Buetow about the Occam Prize, a new award for design innovation.
C2C 7: A Conversation with Industry Icon Bob Black
PCB Chat 80: Wally Rhines on the Latest EDA Sales Data
RM 71: Manufacturer's Reps Talk Sales and Support Post Covid-19
C2C 6: Dr. Mike Stull and Mike Konrad
RM 70: Nano Dimension Cofounder Amit Dror
PCB Chat 79: Bruce Mahler on the Ohmega-Ticer Merger
Concept to Creation 5: Datest's Robert Boguski and Regina Lathrop
PCB Chat 78: Peter Bigelow on 50 Years in PCB Fabrication
RM 69: Part 2 Mike Konrad, Chris Denney and Melissa Hough on the Pick-Place Podcast
Concept to Creation 4: Kyzen's Dr. Mike Bixenman and Tom Forsythe
PCB Chat 77: The Top 50 Electronics Manufacturing Services Companies
RM 68: Chris Denney and Melissa Hough
C2C 3: Mike Scimeca of FCT Assembly on Entrepreneurship
RM 67: Rework/Repair Expert Norman Mier of Best Inc.
C2C: Out of the Box Manufacturing Founders Allison and Chad Budvarson
PCB Chat 76: David Bernard on X-ray Inspection
RM Episode 66: Dr. Ron Lasky and Students
Concept to Creation - The Entrepreneurs of the Electronic Assembly Industry
RM65: Tim O’Neill and Fred Dimock on Voiding, Vacuum Reflow, and Oven Profiling, Part 2
RM 64: Tim O'Neill and Fred Dimock on Voiding, Vacuum Reflow, and Oven Profiling
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