As all of you are well aware, Reliability Matters is all about reliability, specifically reliability of circuit assemblies. One challenge that seems to be persistent within our space is design for manufacturability, or DfM. If you’re a contract manufacturer, no doubt you’ve had the experience of being asked to build a product that seems unbuildable. One example that rings true was the introduction of bottom terminated components or BTCs. BTC’s are marvelous components.
Because all the lead terminations are below the part, they permit highly dense component placement and highly miniaturized assemblies. They also presented a number of unique challenges in reflow, in many cases voiding, cleaning, and inspection. Like many other industries, we are not immune to the introduction of new technologies that may lack implementation knowledge. We then spend the next several years at technical conferences and symposiums learning us how to implement these new technologies. There are many acronyms in our industry that begin with Df…
Design for testability, mechanical assembly, serviceability, reliability, and so many more. So many in fact, that there is a placeholder acronym for all of the various design fours refer to as DFx. Perhaps the holy grail of DFx is DfM (design for manufacturability) as it encompasses so many aspects of assembly.
Today Andrew Williams helps us understand what exactly DFM is. He is engineering manager for electronics manufacturing at PRIDE Industries. He has more than 30 years of experience in manufacturing and design and holds an SMT Process Engineer certification from SMTA and an IPC Certified Electronics Program Manager. He is a guest lecturer at UC Davis and Cal State University Sacramento for Supply Chain Management, Operations, and TQM courses, and speaks frequently on DfM, DfS, and other DfX topics.
RM 117: When Residues Cause Circuit Assemblies to Fail
RM 116: Supply Chain Musings with Mark Godwin of Ventec
PCB Chat 113: David Schild of the Printed Circuit Board Association of America
PCB Chat 112: Vivek Bansal on VVDN’s Vertical Integration Model
PCB Chat 111: Metallic Resources on Reclaiming Electronics Solder
RM 115: Making Sense of ’Big Data’
PCB Chat 110: Steve Robinson of APCT
RM 114: The Remarkable Return of the Post-Reflow Cleaning Process
RM 113: Counterfeit Component Detection with Dr. Eyal Weiss
Business Challenges with STI Electronics’ President David Raby
PCB Chat 109: Wally Rhines on the PCB Design Software Market
PCB Chat 108: Travis Kelly on Government Support of the US PCB Industry
RM 112: ESD Mitigation with ESD Expert Christopher Almeras
RM 111: Liquid Metal’s Potential Future in Electronics
RM 109: A Decade of Industry 4.0 - What it Was - What it Wasn’t
PCB Chat 107: Valentina Ratner and Kyle Dumont of AllSpice
PCB Chat 106: Madan Jagernauth on the Latest HDP Projects
RM 108: SMTA Pan Pacific Microelectronics Symposium Preview
RM 107: IPC Validation Services & the Trusted Supplier Program
RM 106: A Conversation about Production Automation
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