Pros and Cons of Advanced Electronic Packaging for PCB Designers

Our guest Phil Marcoux is very well-known in the advanced electronic packaging community and currently working as a business mentor in the electronics industry. 

Phil is labeled as the father of SMT by the IPC. He is a Charter member of SMT Council, granted the IPC President's Award, past owner of over 40 integrated circuit packaging and camera module-related patents, and consultant on numerous heterogeneous designs and standards, just to name a few of his excellent achievements.

Today we will tackle the pros and cons of heterogeneous electronic assemblies and what we can do as an industry to move forward with it.

Show Highlights:

• Learn about Phil Marcoux and his upcoming panel discussion at PCB West 
  • The panel will discuss “How Heterogeneous Integration Affects the PCB Industry.”
  • Phil is looking forward to promoting PCEA and the need to embrace education
• PCB designers must recognize what compromises they will have to make to utilize that chiplet
  • One of the challenges is to encourage companies to work together and to agree to a standardized chiplet format
• The funding from the federal government may motivate companies to embrace the heterogeneous type of format and the chiplet format.
• Many defense contractors, military products, and advanced electronic products are now rapidly depending on the need for heterogeneous designs
  • Other significant drivers in the market include medical devices, telecommunications, and 5G products
• Most design software are fully capable of handling heterogeneous integration
  • PCB designers can very quickly jump in. Many structures in a printed circuit board, especially in HDI designs, are also used in advanced packages.

Links and Resources:

• Follow Phil Marcoux on LinkedIn
• Learn more about PCB West 2022
• Visit PCEA website
• Full OnTrack Podcast Library
• Altium Website

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