PCB Chat host Mike Buetow catches up on the weekly news in electronics manufacturing. This week: Changes at the top at Nordson and Benchmark, heterogeneous packaging solutions, startup Patchr's new PCB placement and layout software, and EMS earnings reports.
RM 64: Tim O'Neill and Fred Dimock on Voiding, Vacuum Reflow, and Oven Profiling
PCB Chat 75: Keshav and Tarun Amla of Avishtech on Electronics Stackup Tools
RM Episode 63: A Conversation with Reliability Expert Dock Brown
RM Episode 62: A Conversation with Cogiscan's Co-Founder François Monette
PCB Chat 74: DuPont's Andy Kannurpatti
RM Special Edition: A Conversation with IPC Chief Technologist Matt Kelly about IPC Apex
RM 61: A Conversation with Flex Circuit and Additive Electronics Expert Tara Dunn
PCB Chat 73: AJ Incorvaia on Desktop PCB Software
RM 60: Collins' Dave Hillman about Solder Voiding
PCB Chat 72: Matt Wrosch on Transient Liquid Phase Sintering
RM Episode 59: CMOS Inventor Dr. Eric Fossom
PCB Chat 71: Is the US Ready for Smart Manufacturing?
RM 58: 2020 Round-Up
PCB Chat 70: Kent Balius on Front-End Engineering
RM 57: A Conversation with CAF Expert Graham Naisbitt
PCB Chat 69: Manny Marcano on Changes in the Mainstream PCB CAD Market
RM 56: A Conversation about Solder Voiding with Solder Materials, Stencil, and Cleaning Experts
RM 55 - A Conversation with SMTA President Dr. Martin Anselm
PCB Chat Episode 68: The IPC-2581 Consortium on Electronics Data Transfer
PCB Chat Episode 67: Brad Griffin of Cadence on EMI Simulation Tools
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