Cutting Edge Technology in Packaging with an Interposer

In this episode, our guest Joe Dickson, tells us about the cutting-edge technology implemented in advanced packaging at Wus Printed Circuit International.  

Watch the episode here

Show Highlights:

• Joe Dickson talks about what they do at Wus, a printed circuit manufacturing company
  • He shares about their efforts to bring PCB technologies farther up by introducing advanced packaging options
  • He briefly describes what printed circuit-like materials are, also known as the vertical interposers or PCIe
• Zach explains how a pre-packaged chip can be mounted on a board
• What are the reliability and signal integrity challenges that come with assembling different packages on a board
  • Off-the-board solutions start to become more and more desirable 
• The flexibility of design and components is what driving the market to use more integrated packaging
• Speed is everything! When will the industry move on from copper and go to optical? 
• Knowing what's going on in simulations is very important; it opens opportunities to try new things
• Joe explains a way of using Faraday cages with cable connections on the surface
• Examples of the large market using the PCIe method are Xilinx and NVIDIA
• How far is silicon photonics from becoming mainstream as an interconnect technology?
• Standardazion versus innovation
• The future of PCB assembly is hybrid. Some will use the off-shelf, best-in-class products from Intel, AMB, NVIDIA, Xilinx, and get creative with them. 

Links and Resources:

• Connect with Joe Dickson on LinkedIn
• Visit Wus Printed Circuit International website
• Watch the related episode:
  • Eliminating Nuances in the PCB Manufacturing Processes with Amit Bahl of Sierra Circuits PCB
• Connect with Zach on LinkedIn
• Full OnTrack Podcast Library
• Altium Website

 

Get Your First Month of Altium Designer® for FREE