The High-Density Packaging User Group, the nonprofit consortium of electronics manufacturers and suppliers that collaborate on various technical problems in order to reduce cost and time to market, has nearly 25 projects underway, several of which are due to be completed this year.
We spoke this month with Madan Jagernauth, marketing director and project facilitator of HDP, about their current research on lead-free solder alloys, the recent conference Best Papers, and whether the consortium members are ready to tackle artificial intelligence.
PCB Chat: The Screw-Ups, Episode 1
Reliability Matters Episode 1 - An Interview with SMT Guru Bob Willis
PCB Chat Episode 28 - Joe Fama
The Week Today - Dec. 10-14, 2018
PCB Chat Episode 26 - Thoughts on the Past and Future
PCB Chat Episode 25 - "The Hitchhikers Guide to PCB Design" Authors Roundtable
PCB Chat Episode 24 - Mike Buetow
PCB Chat Episode 23: Just Who is the Designer or Engineer of Today?
PCB Chat Episode 22 - Marc Benowitz
PCB Chat Episode 21 - Mark Finstad and Nick Koop
PCB Chat Episode 20 - Brenda Baney
PCB Chat Episode 5 - Joe Fjelstad
PCB Chat Episode 19 - Bill Hargin
PCB Chat Episode 18 - Mike Tucker
PCB Chat Episode 17 - Hans Stahl
PCB Chat Episode 16 - Mike Buetow
PCB Chat Episode 15 - Mike Buetow
PCB Chat Episode 14 - Manny Marcano
PCB Chat Episode 13 - Bill Cardoso
PCB Chat Episode 12 - John Mitchell and Chris Mitchell
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