In the last half of the 20th century, cleaning of circuit assemblies was a standard assembly practice. The abolishment of popular CFC-based cleaning solvents ushered the introduction of "no-clean" assembly processes. For much of the electronic assembly industry, cleaning became nonexistent.
Due to assembly and component miniaturization and the explosion of both IOT and automotive electronics, which places many circuit assemblies into harsh environments, the practice of removing harmful ionic contamination from circuit assemblies has once again become a mainstream practice. Today, the majority of electronic assemblies are cleaned. And, for many assemblers, cleaning is a new process.
This podcast presents modern best-practice cleaning techniques including:
- An historical look back at cleaning
- The reason for cleaning
- Reasons for cleaning no-clean flux residues
- Conventional cleaning technologies
- Estimating throughput capabilities on batch and inline cleaning systems
- Do's and don'ts of cleaning circuit assemblies
- How to choose a cleaning chemical (if needed)
- How to determine the assemblies are clean during the cleaning process
- How to determine the assemblies are clean after the cleaning process
- New IPC Cleanliness assessment standards
- Environmental mitigation techniques
- Calculating the per-assembly cost of cleaning
- Keeping your cleaning machine in top-working order
RM 106: A Conversation about Production Automation
PCB Chat 105: Low-Heat Solders with Ian Tevis of SAFI-Tech and Andy Mackie of Indium
RM 105: Conformal Coating Material Selection Best Practices
PCB Chat 104: Wang Lu of Jove Enterprises
RM 104: Thomas Ricciardelli on ESD Flooring
PCB Chat 103: Stephen Chavez on Design Automation
RM 103: SMT Assembly Equipment for Low-Volume Applications
RM 102: Contract Manufacturer Selection Process Best Practices
RM 101: The Future of US Manufacturing with IPC’s Matt Kelly
RM 100: A 100th Episode Special (Recorded Live)
PCB Chat 102: Dr. Matthew Dyson on the Factory of the Future
PCB Chat 101: Brian Morrison on Smart Manufacturing
RM 99: Graham Naisbitt on IPC Cleanliness Standard Compliance
PCB Chat 100: John Burkhert Jr. on Engineering Soft Skills
RM 98: Jen Fijalkowski on Advances in Solder Pastes
PCB Chat 99: RIT PCB Design Curriculum
RM 97: Best Practices for Purchasing X-Ray Equipment
RM 96: Phil Zarrow and Jim Hall on Their New Book
PCB Chat 98: The Cadence Allegro/ Dassault Systèmes 3DExperience Integration
PCB Chat 97: Travis Kelly on the Printed Circuit Board Association of America
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