In the last half of the 20th century, cleaning of circuit assemblies was a standard assembly practice. The abolishment of popular CFC-based cleaning solvents ushered the introduction of "no-clean" assembly processes. For much of the electronic assembly industry, cleaning became nonexistent.
Due to assembly and component miniaturization and the explosion of both IOT and automotive electronics, which places many circuit assemblies into harsh environments, the practice of removing harmful ionic contamination from circuit assemblies has once again become a mainstream practice. Today, the majority of electronic assemblies are cleaned. And, for many assemblers, cleaning is a new process.
This podcast presents modern best-practice cleaning techniques including:
- An historical look back at cleaning
- The reason for cleaning
- Reasons for cleaning no-clean flux residues
- Conventional cleaning technologies
- Estimating throughput capabilities on batch and inline cleaning systems
- Do's and don'ts of cleaning circuit assemblies
- How to choose a cleaning chemical (if needed)
- How to determine the assemblies are clean during the cleaning process
- How to determine the assemblies are clean after the cleaning process
- New IPC Cleanliness assessment standards
- Environmental mitigation techniques
- Calculating the per-assembly cost of cleaning
- Keeping your cleaning machine in top-working order
PCB Chat 75: Keshav and Tarun Amla of Avishtech on Electronics Stackup Tools
RM Episode 63: A Conversation with Reliability Expert Dock Brown
RM Episode 62: A Conversation with Cogiscan's Co-Founder François Monette
PCB Chat 74: DuPont's Andy Kannurpatti
RM Special Edition: A Conversation with IPC Chief Technologist Matt Kelly about IPC Apex
RM 61: A Conversation with Flex Circuit and Additive Electronics Expert Tara Dunn
PCB Chat 73: AJ Incorvaia on Desktop PCB Software
RM 60: Collins' Dave Hillman about Solder Voiding
PCB Chat 72: Matt Wrosch on Transient Liquid Phase Sintering
RM Episode 59: CMOS Inventor Dr. Eric Fossom
PCB Chat 71: Is the US Ready for Smart Manufacturing?
RM 58: 2020 Round-Up
PCB Chat 70: Kent Balius on Front-End Engineering
RM 57: A Conversation with CAF Expert Graham Naisbitt
PCB Chat 69: Manny Marcano on Changes in the Mainstream PCB CAD Market
RM 56: A Conversation about Solder Voiding with Solder Materials, Stencil, and Cleaning Experts
RM 55 - A Conversation with SMTA President Dr. Martin Anselm
PCB Chat Episode 68: The IPC-2581 Consortium on Electronics Data Transfer
PCB Chat Episode 67: Brad Griffin of Cadence on EMI Simulation Tools
Reliability Matters Episode 54: A Conversation with Michael Ford about Digital Twin
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