On this show, we’ve discussed many aspects of the electronics assembly process. We talked about reflow, thermal management, printing, soldering materials, additives, and so much more. What do all these topics have in common? When done correctly, they all contribute to the reliability of circuit assemblies.
Today, we’re going to dive into the subject of cleaning circuit assemblies after reflow. For many assemblers, the cleaning process was replaced by the use of no clean flux technology. Time and technology have eroded the concept of allowing all residues to remain on the assembly. Today, residue caused failures are such a concern, that IPC recently and radically changed the way circuit assemblies are considered to be clean.
Mike Konrad's guests are Sal Sparacino and Eric Camden. Sal is sirector of sales at Zestron Americas, located in Manassas, VA. Zestron is a manufacturer of cleaning chemicals for the electronics industry. Eric is lead investigator for Foresite, an analytical laboratory based in Kokomo IN. Eric, is the person you call when things go wrong. Together with my experience as a cleaning equipment manufacturer, we’ll discuss how cleaning contributes to increased reliability, and we’ll review the reasons cleaning has returned as a mainstream assembly process.
PCB Chat 97: Travis Kelly on the Printed Circuit Board Association of America
RM 95: SMTA SMT Certification Course Authors Dr. Ron Lasky and Jim Hall
RM 94: Dr. Ron Lasky on His Many Books
RM 93: Dr. Kunal Shah on Ni-Less ENIG
PCB Chat 96: The Latest HDP Initiatives with Jack Fisher and Madan Jagernauth
PCB Chat 95: Latest PCB ECAD Market Data with Wally Rhines
RM 92: IPC Apex Expo Conversations: Reflow Thermal Control / Automated Device Programming
RM 91: Conversations from IPC APEX Expo - Inspection Systems - Contract Assembly - and Pirates!
PCB Chat 94: Michael Kirschner on Sustainability Standards
RM 90: Mike Adamson on Component Storage
PCB Chat 93: Mack Technologies on EMS Manufacturing in Mexico
RM 89: Tombstoning Mitigation with Tony Lentz
PCB Chat 92: Dr. James Lee and Chris Banton on RIT’s PCB Design Curriculum
RM 88: Indium’s Brian O’Leary on Electric Vehicles
PCB Chat 91: Wally Rhines on the Latest ECAD Software Trends
PCB Chat 90: Travis Kelly on the PCBAA
RM 84: Christopher Frederickson on Solder Paste Inspection
PCB Chat 89: College Training Programs for Electronics
PCB Chat 88: HDP Users Group Update
C2C 12: Smart Splice Cofounder Larry Welk
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