On this show, we’ve discussed many aspects of the electronics assembly process. We talked about reflow, thermal management, printing, soldering materials, additives, and so much more. What do all these topics have in common? When done correctly, they all contribute to the reliability of circuit assemblies.
Today, we’re going to dive into the subject of cleaning circuit assemblies after reflow. For many assemblers, the cleaning process was replaced by the use of no clean flux technology. Time and technology have eroded the concept of allowing all residues to remain on the assembly. Today, residue caused failures are such a concern, that IPC recently and radically changed the way circuit assemblies are considered to be clean.
Mike Konrad's guests are Sal Sparacino and Eric Camden. Sal is sirector of sales at Zestron Americas, located in Manassas, VA. Zestron is a manufacturer of cleaning chemicals for the electronics industry. Eric is lead investigator for Foresite, an analytical laboratory based in Kokomo IN. Eric, is the person you call when things go wrong. Together with my experience as a cleaning equipment manufacturer, we’ll discuss how cleaning contributes to increased reliability, and we’ll review the reasons cleaning has returned as a mainstream assembly process.
RM 64: Tim O'Neill and Fred Dimock on Voiding, Vacuum Reflow, and Oven Profiling
PCB Chat 75: Keshav and Tarun Amla of Avishtech on Electronics Stackup Tools
RM Episode 63: A Conversation with Reliability Expert Dock Brown
RM Episode 62: A Conversation with Cogiscan's Co-Founder François Monette
PCB Chat 74: DuPont's Andy Kannurpatti
RM Special Edition: A Conversation with IPC Chief Technologist Matt Kelly about IPC Apex
RM 61: A Conversation with Flex Circuit and Additive Electronics Expert Tara Dunn
PCB Chat 73: AJ Incorvaia on Desktop PCB Software
RM 60: Collins' Dave Hillman about Solder Voiding
PCB Chat 72: Matt Wrosch on Transient Liquid Phase Sintering
RM Episode 59: CMOS Inventor Dr. Eric Fossom
PCB Chat 71: Is the US Ready for Smart Manufacturing?
RM 58: 2020 Round-Up
PCB Chat 70: Kent Balius on Front-End Engineering
RM 57: A Conversation with CAF Expert Graham Naisbitt
PCB Chat 69: Manny Marcano on Changes in the Mainstream PCB CAD Market
RM 56: A Conversation about Solder Voiding with Solder Materials, Stencil, and Cleaning Experts
RM 55 - A Conversation with SMTA President Dr. Martin Anselm
PCB Chat Episode 68: The IPC-2581 Consortium on Electronics Data Transfer
PCB Chat Episode 67: Brad Griffin of Cadence on EMI Simulation Tools
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