Mark Finstad is senior application engineer for Flexible Circuit Technologies. He has over 30 years of experience designing and manufacturing flexible circuits for commercial, medical, and military/avionics applications. He co-chairs the IPC-2223 Design Standard for Flexible Printed boards and coauthors the Ask the Flexperts column for PCD&F magazine.
Nick Koop is a senior field application engineer for TTM Technologies and has over 30 years of design, manufacturing and management experience in the flexible circuit industry. He developed and applied advanced PCB technologies to support a wide range medical, military, and global security applications. He is vice chairman of the IPC Flexible Circuits Committee, co-chair for the IPC-6013 Qualification and Performance Specification for Flexible Printed Boards Subcommittee, and coauthors the Ask the Flexperts column for PCD&F magazine.
They discuss real-life flex circuit struggles and how to overcome them with PCB Chat's Mike Buetow.
RM 118: Making ’Big Data’ Useful with Intraratio’s Ryan Gamble
RM 117: When Residues Cause Circuit Assemblies to Fail
RM 116: Supply Chain Musings with Mark Godwin of Ventec
PCB Chat 113: David Schild of the Printed Circuit Board Association of America
PCB Chat 112: Vivek Bansal on VVDN’s Vertical Integration Model
PCB Chat 111: Metallic Resources on Reclaiming Electronics Solder
RM 115: Making Sense of ’Big Data’
PCB Chat 110: Steve Robinson of APCT
RM 114: The Remarkable Return of the Post-Reflow Cleaning Process
RM 113: Counterfeit Component Detection with Dr. Eyal Weiss
Business Challenges with STI Electronics’ President David Raby
PCB Chat 109: Wally Rhines on the PCB Design Software Market
PCB Chat 108: Travis Kelly on Government Support of the US PCB Industry
RM 112: ESD Mitigation with ESD Expert Christopher Almeras
RM 111: Liquid Metal’s Potential Future in Electronics
RM 109: A Decade of Industry 4.0 - What it Was - What it Wasn’t
PCB Chat 107: Valentina Ratner and Kyle Dumont of AllSpice
PCB Chat 106: Madan Jagernauth on the Latest HDP Projects
RM 108: SMTA Pan Pacific Microelectronics Symposium Preview
RM 107: IPC Validation Services & the Trusted Supplier Program
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