According to Puneet Gupta, Ph.D. and his colleagues at UCLA including Subramanian Iyer, Ph.D., the printed circuit board is a constraint on electronics size and speed. And the solution is to get rid of it. The professors have developed a method to replace PCBs with an all-silicon technology, called silicon-interconnect fabric, which allows bare chips to be connected directly to wiring on a separate piece of silicon. The wiring between chips on fabric is at the nanometer scale, much like the wiring within a chip. Dr. Gupta asserts many more chip-to-chip connections are thus possible, and those connections are able to transmit data faster while using less energy. He discusses the technology and its implications with PCB Chat host Mike Buetow.
PCB Chat 87: Jorge Cardona on EMS in Colombia
RM 82: Paul Salerno on Soldering Materials and Selection
PCB Chat 86: Wally Rhines on the ECAD Market Data
RM 80: Cheryl Tulkoff and Greg Caswell on DfX
RM 79: Arch Systems‘ Dave Trail about Industry 4.0
PCB Chat 85: Matt Dyson on Electrically Conductive Adhesives
C2C 11: Poligage Founder and CEO Christine Davies
RM 77: James Kovacevic on Maintenance Reliability Training
RM 76 - Meet the Press
RM 75: Matric Group‘s Patrick Stimpert on Lean Manufacturing
C2C 10: Zestron‘s Dr. Harald Wack
PCB Chat 84: Gowtham Ramachandran on the ‘Desktop Microfactory‘
C2C 9: Foresite Founder Terry Munson
RM 74: Worthington Assembly's Chris Denney on Contract Manufacturing
RM 73: Solder Paste Expert Tim Jensen of Indium
PCB Chat 83: Vincent Bedat of Volthub on OEM-EMS Data Sharing
C2C 8: STI Electronics' David Raby
RM 72: Thermal Profiling with ECD's Mark Waterman
PCB Chat 82: The RIT CEMA Capstone Project Team
PCB Chat 81: Terry Jernberg of EMA on Power Integrity
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