According to Puneet Gupta, Ph.D. and his colleagues at UCLA including Subramanian Iyer, Ph.D., the printed circuit board is a constraint on electronics size and speed. And the solution is to get rid of it. The professors have developed a method to replace PCBs with an all-silicon technology, called silicon-interconnect fabric, which allows bare chips to be connected directly to wiring on a separate piece of silicon. The wiring between chips on fabric is at the nanometer scale, much like the wiring within a chip. Dr. Gupta asserts many more chip-to-chip connections are thus possible, and those connections are able to transmit data faster while using less energy. He discusses the technology and its implications with PCB Chat host Mike Buetow.
RM 118: Making ’Big Data’ Useful with Intraratio’s Ryan Gamble
RM 117: When Residues Cause Circuit Assemblies to Fail
RM 116: Supply Chain Musings with Mark Godwin of Ventec
PCB Chat 113: David Schild of the Printed Circuit Board Association of America
PCB Chat 112: Vivek Bansal on VVDN’s Vertical Integration Model
PCB Chat 111: Metallic Resources on Reclaiming Electronics Solder
RM 115: Making Sense of ’Big Data’
PCB Chat 110: Steve Robinson of APCT
RM 114: The Remarkable Return of the Post-Reflow Cleaning Process
RM 113: Counterfeit Component Detection with Dr. Eyal Weiss
Business Challenges with STI Electronics’ President David Raby
PCB Chat 109: Wally Rhines on the PCB Design Software Market
PCB Chat 108: Travis Kelly on Government Support of the US PCB Industry
RM 112: ESD Mitigation with ESD Expert Christopher Almeras
RM 111: Liquid Metal’s Potential Future in Electronics
RM 109: A Decade of Industry 4.0 - What it Was - What it Wasn’t
PCB Chat 107: Valentina Ratner and Kyle Dumont of AllSpice
PCB Chat 106: Madan Jagernauth on the Latest HDP Projects
RM 108: SMTA Pan Pacific Microelectronics Symposium Preview
RM 107: IPC Validation Services & the Trusted Supplier Program
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