According to Puneet Gupta, Ph.D. and his colleagues at UCLA including Subramanian Iyer, Ph.D., the printed circuit board is a constraint on electronics size and speed. And the solution is to get rid of it. The professors have developed a method to replace PCBs with an all-silicon technology, called silicon-interconnect fabric, which allows bare chips to be connected directly to wiring on a separate piece of silicon. The wiring between chips on fabric is at the nanometer scale, much like the wiring within a chip. Dr. Gupta asserts many more chip-to-chip connections are thus possible, and those connections are able to transmit data faster while using less energy. He discusses the technology and its implications with PCB Chat host Mike Buetow.
C2C 7: A Conversation with Industry Icon Bob Black
PCB Chat 80: Wally Rhines on the Latest EDA Sales Data
RM 71: Manufacturer's Reps Talk Sales and Support Post Covid-19
C2C 6: Dr. Mike Stull and Mike Konrad
RM 70: Nano Dimension Cofounder Amit Dror
PCB Chat 79: Bruce Mahler on the Ohmega-Ticer Merger
Concept to Creation 5: Datest's Robert Boguski and Regina Lathrop
PCB Chat 78: Peter Bigelow on 50 Years in PCB Fabrication
RM 69: Part 2 Mike Konrad, Chris Denney and Melissa Hough on the Pick-Place Podcast
Concept to Creation 4: Kyzen's Dr. Mike Bixenman and Tom Forsythe
PCB Chat 77: The Top 50 Electronics Manufacturing Services Companies
RM 68: Chris Denney and Melissa Hough
C2C 3: Mike Scimeca of FCT Assembly on Entrepreneurship
RM 67: Rework/Repair Expert Norman Mier of Best Inc.
C2C: Out of the Box Manufacturing Founders Allison and Chad Budvarson
PCB Chat 76: David Bernard on X-ray Inspection
RM Episode 66: Dr. Ron Lasky and Students
Concept to Creation - The Entrepreneurs of the Electronic Assembly Industry
RM65: Tim O’Neill and Fred Dimock on Voiding, Vacuum Reflow, and Oven Profiling, Part 2
RM 64: Tim O'Neill and Fred Dimock on Voiding, Vacuum Reflow, and Oven Profiling
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